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Laser Engraving, Cutting and Marking.

Universal Laser Systems, Inc. manufactures computer controlled laser engraving, laser cutting and laser marking systems. Universal Laser, widely recognized as the leader in their industry, has continuously created many innovative improvements to their products over the years. The only manufacturer of the complete system, including the Laser itself, has allowed them to be awarded over 25 US patents. There are over 30,000 Universal Lasers sold since 1997, over 90% of which are still in active use today!. Universal’s success is due to many years of making the longest-lasting, lowest maintenance, & best supported systems in the world.

The many benefits of adding laser engraving & cutting to your business include:

  • The ability to cut mark and fabricate a huge variety of substrates – more than any printer, plotter, or router combined.
  • Super simple operation – no special training required. As easy as a regular printer.
  • High-quality results – professional results with no special skills needed – even on the first try!
  • Small footprint, clean, & quiet – does not require a dedicated area. Can be used in an office environment.
  • Very little to no handling required for producing ready-to-sell items.
  • Significantly broaden your product offering to new & existing customers. Provides a competitive edge and a new profit center for your business with a minimum space, labor, and financial commitment

Works with all Windows based graphics programs CorelDrRAW!, Illustrator, AutoCAD, FlexiSign, Omega, and more!

Cedar Hollow Sales is an authorized sales and service center for Universal Laser Systems.

VLS Desktop Series

Compact and Economical Entry Level Platforms

VLS2.30DT

The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16″ x 12″ x 4″ or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO2 30 watt laser source.

Features

Laser Material Processing Area (W x H) 16 x 12 in (406 x 305 mm)
Maximum Part Size (W x H x D) 18.75 x 14.6 x 4.0 in (476 x 370 x 102 mm)
Overall Dimension (W x H x D) 26 x 14 x 25 in (661 x 356 x 635 mm)
Rotary Capacity

Max Diameter: 4.0 in (102 mm)

Min Diameter: 1.0 in (25.4 mm)

Motorized Z Axis Lifting Capacity 20 lbs (9 kg)
Available Focus Lenses

2.0 in (50 mm)

HPDFO™ (High Power Density Focusing Optics)

Laser Platform Interface Panel Five button keypad
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included gas assist
Cabinet Style Desktop
Laser Options 10 and 30 Watts
Weight 70 lbs (32 kg)
Power Requirements

110V/10A

220V-240V/5A

Exhaust Requirements

One 3 in (76 mm) port

150 CFM @ 6 in static pressure (255 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

VLS3.60DT

The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24″ x 12″ x 4″ or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equipped with one of five 10.6µm CO2 laser sources ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source.

Features

Laser Material Processing Area (W x H) 24 x 12 in (610 x 305 mm)
Maximum Part Size (W x H x D) 26.75 x 14.6 x 4 in (679 x 370 x 102 mm)
Overall Dimension (W x H x D) 34 x 14 x 25 in (864 x 356 x 635 mm)
Rotary Capacity

Max Diameter: 4.0 in (102 mm)

Min Diameter: 1.0 in (25.4 mm)

Motorized Z Axis Lifting Capacity 20 lbs (9 kg)
Available Focus Lenses

2.0 in (50 mm)

HPDFO™ (High Power Density Focusing Optics)

Laser Platform Interface Panel Five button keypad
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included gas assist
Cabinet Style Desktop
Laser Options 10, 30, 40, 50 and 60 Watts
Weight 95 lbs (43 kg)
Power Requirements

110V/10A

220V-240V/5A

Exhaust Requirements

One 3 in (76 mm) port

250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

VLS Series

Free-Standing Platforms

VLS3.75

The VLS3.75 is a free-standing platform with a materials processing envelope of 24″ x 12″ x 8.5″ or 2,448 in³ (610 x 305 x 216 mm or 40,187 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source.

Features

Laser Material Processing Area (W x H) 24 x 12 in (610 x 305 mm)
Maximum Part Size (W x H x D) 29 x 17 x 8.5 in (737 x 432 x 216 mm)
Overall Dimension (W x H x D) 36 x 38 x 30 in (914 x 965 x 762 mm)
Rotary Capacity Max Diameter: 8 in (203 mm)
Motorized Z Axis Lifting Capacity 40 lbs (18 kg)
Available Focus Lenses

2.0 in (50 mm)

HPDFO™ (High Power Density Focusing Optics)

Laser Platform Interface Panel Five button keypad
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included gas assist
Cabinet Style Free-Standing
Laser Options 10, 30, 40, 50, 60 and 75 Watts
Weight 235 lbs (107 kg)
Power Requirements

110V/10A

220V-240V/5A

Exhaust Requirements

One 4 in (102 mm) port

250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

VLS4.75

The VLS4.75 is a free-standing platform with a materials processing envelope of 24″ x 18″ x 8.5″ or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source.

Features

Laser Material Processing Area (W x H) 24 x 18 in (610 x 457 mm)
Maximum Part Size (W x H x D) 29 x 23 x 8.5 in (737 x 584 x 216 mm)
Overall Dimension (W x H x D) 36 x 38 x 36 in (914 x 965 x 914 mm)
Rotary Capacity Max Diameter: 8 in (203 mm)
Motorized Z Axis Lifting Capacity 40 lbs (18 kg)
Available Focus Lenses

2.0 in (50 mm)

HPDFO™ (High Power Density Focusing Optics)

Laser Platform Interface Panel Five button keypad
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included gas assist
Cabinet Style Free-Standing
Laser Options 10, 30, 40, 50, 60 and 75 Watts
Weight 270 lbs (122 kg)
Power Requirements

110V/10A

220V-240V/5A

Exhaust Requirements

One 4 in (102 mm) port

250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

VLS6.75

The VLS6.75 is a free-standing platform with a material processing envelope of 32″ x 18″ x 8.5″ or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source.

Features

Laser Material Processing Area (W x H) 32 x 18 in (813 x 457 mm)
Maximum Part Size (W x H x D) 37 x 23 x 8.5 in (940 x 584 x 216 mm)
Overall Dimension (W x H x D) 44 x 39 x 36 in (1118 x 991 x 914 mm)
Rotary Capacity Max Diameter: 8 in (203 mm)
Motorized Z Axis Lifting Capacity 40 lbs (18 kg)
Available Focus Lenses

2.0 in (50 mm)

HPDFO™ (High Power Density Focusing Optics)

Laser Platform Interface Panel Five button keypad
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included gas assist
Cabinet Style Free-Standing
Laser Options 10, 30, 40, 50, 60 and 75 Watts
Weight 325 lbs (147 kg)
Power Requirements

110V/10A

220V-240V/5A

Exhaust Requirements

Two 4 in (102 mm) ports

500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

PLS Series

Free-Standing Platforms

PLS6.150D

The PLS6.150D is a free-standing platform with a materials processing envelope of 32″ x 18″ x 8.5″ or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³) that supports dual lasers. As a dual laser platform, the PLS6.150 can support up to two 10.6µm CO2 lasers with a power range of 10 watts to 150 watts. Additionally, it can support a single 9.3µm CO2 of 30, 50 or 75 watts. (if a 9.3µm CO2 laser is installed, only one 10.6µm CO2 of up to 75 watts may be installed at the same time.)

Features

Laser Material Processing Area (W x H) 32 x 18 in (813 x 457 mm)
Maximum Part Size (W x H x D) 37 x 23 x 8.5 in (940 x 584 x 216 mm)
Overall Dimension (W x H x D) 44 x 39 x 36 in (1118 x 991 x 914 mm)
Rotary Capacity Max Diameter 8 in (203 mm)
Motorized Z Axis Lifting Capacity 40 lbs (18 kg)
Available Focus Lenses

2.0 in (51 mm)

HPDFO™ (High Power Density Focusing Optics)

Laser Platform Interface Panel Keypad and LCD display show current file name, laser power, engraving speed, PPI and run time.
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included Gas Assist
Cabinet Style Free-Standing
Laser Options

10, 30, 40, 50, 60 and 75 watts

Equipped for two lasers – must be of equal power

Weight 345 lbs (156 kg)
Power Requirements 220V-240V/15A
Exhaust Requirements

Two 4 in (102 mm) ports

500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

PLS6MW

The PLS6MW (Multi-Wavelength) is a free-standing platform uses multiple laser wavelengths to process the broadest possible spectrum of materials and supports either CO2 or fiber lasers. The PLS6MW has a materials processing envelope of 32″ x 18″ x 8.5″ or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). With Universal’s Rapid Reconfiguration technology, any one of the following lasers can be used: one 10.6µm CO2 laser (available from 10 to 75 watts); one 9.3µm CO2 laser (available in 30, 50 or 75 watts); one 1.06µm fiber laser (available in 40 and 50 watts).

Features

Work Area 32 x 18 in (813 x 457 mm)
Maximum Part Size (W x H x D) 37 x 23 x 8.5 in (940 x 584 x 216 mm)
Overall Dimension (W x H x D) 44 x 39 x 36 in (1118 x 991 x 914 mm)
Rotary Capacity Max Diameter: 8 in (203 mm)
Motorized Z Axis Lifting Capacity 40 lbs (18 kg)
Available Focus Lenses

2.0 in (50 mm) MW

recommended for most 10.6 and 9.3 micron applications

4.0 in (100 mm) MW

recommended for most 1.06 micron applications

HPDFO™ (High Power Density Focusing Optics) MW

Laser Platform Interface Panel Keypad and LCD display show current file name, laser power, engraving speed, PPI and run time.
Computer Requirements Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher)
Optics Protection Integrated with included Gas Assist
Cabinet Style Free-Standing
1.06 µm (Fiber) 40 and 50 Watts
10.6 µm (CO2) 10, 30, 40, 50, 60 and 75 Watts
9.3 µm (CO2) 30, 50, and 75 Watts
Weight 345 lbs (156 kg)
Power Requirements

110V/10A

220V-240V/5A

Exhaust Requirements

Two 4 in (102 mm) ports

500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa)

Click here for a printable PDF overview sheet.

Ultra Series

Laser Processing for a Wide Range of Materials

ULTRA R5000

The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.

The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).

Configure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.

Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.

Click here for a printable PDF overview sheet.

ULTRA X6000

The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.

The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).

Configure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser. When the platform is configured with three lasers, users can take full advantage of MultiWave Hybrid™ technology enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.

Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision material-independent autofocus, controllable laser power density, an automation interface, camera registration, an integrated touch screen control panel, over temperature detection, and support for fire suppression.

Click here for a printable PDF overview sheet.

ULTRA R9000

The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.

The ULTRA R9000 platform has a materials processing envelope of 48 x 24 in (1219 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).

Configure the customizable ULTRA R9000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.

Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.

Click here for a printable PDF overview sheet.

Universal Laser Systems Uses

Get In Touch

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Hours

Monday - Friday
9:00 AM - 5:00 PM

Corporate Location

1101 Church Road
Malvern PA 19355