Laser Engraving, Cutting and Marking.
Universal Laser Systems, Inc. manufactures computer controlled laser engraving, laser cutting and laser marking systems. Universal Laser, widely recognized as the leader in their industry, has continuously created many innovative improvements to their products over the years. The only manufacturer of the complete system, including the Laser itself, has allowed them to be awarded over 25 US patents. There are over 30,000 Universal Lasers sold since 1997, over 90% of which are still in active use today!. Universal’s success is due to many years of making the longest-lasting, lowest maintenance, & best supported systems in the world.
The many benefits of adding laser engraving & cutting to your business include:
- The ability to cut mark and fabricate a huge variety of substrates – more than any printer, plotter, or router combined.
- Super simple operation – no special training required. As easy as a regular printer.
- High-quality results – professional results with no special skills needed – even on the first try!
- Small footprint, clean, & quiet – does not require a dedicated area. Can be used in an office environment.
- Very little to no handling required for producing ready-to-sell items.
- Significantly broaden your product offering to new & existing customers. Provides a competitive edge and a new profit center for your business with a minimum space, labor, and financial commitment
Works with all Windows based graphics programs CorelDrRAW!, Illustrator, AutoCAD, FlexiSign, Omega, and more!
Cedar Hollow Sales is an authorized sales and service center for Universal Laser Systems.
VLS Desktop Series
Compact and Economical Entry Level Platforms
VLS2.30DT
Features
Laser Material Processing Area (W x H) | 16 x 12 in (406 x 305 mm) |
Maximum Part Size (W x H x D) | 18.75 x 14.6 x 4.0 in (476 x 370 x 102 mm) |
Overall Dimension (W x H x D) | 26 x 14 x 25 in (661 x 356 x 635 mm) |
Rotary Capacity |
Max Diameter: 4.0 in (102 mm) Min Diameter: 1.0 in (25.4 mm) |
Motorized Z Axis Lifting Capacity | 20 lbs (9 kg) |
Available Focus Lenses |
2.0 in (50 mm) HPDFO™ (High Power Density Focusing Optics) |
Laser Platform Interface Panel | Five button keypad |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included gas assist |
Cabinet Style | Desktop |
Laser Options | 10 and 30 Watts |
Weight | 70 lbs (32 kg) |
Power Requirements |
110V/10A 220V-240V/5A |
Exhaust Requirements |
One 3 in (76 mm) port 150 CFM @ 6 in static pressure (255 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
VLS3.60DT
Features
Laser Material Processing Area (W x H) | 24 x 12 in (610 x 305 mm) |
Maximum Part Size (W x H x D) | 26.75 x 14.6 x 4 in (679 x 370 x 102 mm) |
Overall Dimension (W x H x D) | 34 x 14 x 25 in (864 x 356 x 635 mm) |
Rotary Capacity |
Max Diameter: 4.0 in (102 mm) Min Diameter: 1.0 in (25.4 mm) |
Motorized Z Axis Lifting Capacity | 20 lbs (9 kg) |
Available Focus Lenses |
2.0 in (50 mm) HPDFO™ (High Power Density Focusing Optics) |
Laser Platform Interface Panel | Five button keypad |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included gas assist |
Cabinet Style | Desktop |
Laser Options | 10, 30, 40, 50 and 60 Watts |
Weight | 95 lbs (43 kg) |
Power Requirements |
110V/10A 220V-240V/5A |
Exhaust Requirements |
One 3 in (76 mm) port 250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
VLS Series
Free-Standing Platforms
VLS3.75
Features
Laser Material Processing Area (W x H) | 24 x 12 in (610 x 305 mm) |
Maximum Part Size (W x H x D) | 29 x 17 x 8.5 in (737 x 432 x 216 mm) |
Overall Dimension (W x H x D) | 36 x 38 x 30 in (914 x 965 x 762 mm) |
Rotary Capacity | Max Diameter: 8 in (203 mm) |
Motorized Z Axis Lifting Capacity | 40 lbs (18 kg) |
Available Focus Lenses |
2.0 in (50 mm) HPDFO™ (High Power Density Focusing Optics) |
Laser Platform Interface Panel | Five button keypad |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included gas assist |
Cabinet Style | Free-Standing |
Laser Options | 10, 30, 40, 50, 60 and 75 Watts |
Weight | 235 lbs (107 kg) |
Power Requirements |
110V/10A 220V-240V/5A |
Exhaust Requirements |
One 4 in (102 mm) port 250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
VLS4.75
Features
Laser Material Processing Area (W x H) | 24 x 18 in (610 x 457 mm) |
Maximum Part Size (W x H x D) | 29 x 23 x 8.5 in (737 x 584 x 216 mm) |
Overall Dimension (W x H x D) | 36 x 38 x 36 in (914 x 965 x 914 mm) |
Rotary Capacity | Max Diameter: 8 in (203 mm) |
Motorized Z Axis Lifting Capacity | 40 lbs (18 kg) |
Available Focus Lenses |
2.0 in (50 mm) HPDFO™ (High Power Density Focusing Optics) |
Laser Platform Interface Panel | Five button keypad |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included gas assist |
Cabinet Style | Free-Standing |
Laser Options | 10, 30, 40, 50, 60 and 75 Watts |
Weight | 270 lbs (122 kg) |
Power Requirements |
110V/10A 220V-240V/5A |
Exhaust Requirements |
One 4 in (102 mm) port 250 CFM @ 6 in static pressure (425 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
VLS6.75
Features
Laser Material Processing Area (W x H) | 32 x 18 in (813 x 457 mm) |
Maximum Part Size (W x H x D) | 37 x 23 x 8.5 in (940 x 584 x 216 mm) |
Overall Dimension (W x H x D) | 44 x 39 x 36 in (1118 x 991 x 914 mm) |
Rotary Capacity | Max Diameter: 8 in (203 mm) |
Motorized Z Axis Lifting Capacity | 40 lbs (18 kg) |
Available Focus Lenses |
2.0 in (50 mm) HPDFO™ (High Power Density Focusing Optics) |
Laser Platform Interface Panel | Five button keypad |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included gas assist |
Cabinet Style | Free-Standing |
Laser Options | 10, 30, 40, 50, 60 and 75 Watts |
Weight | 325 lbs (147 kg) |
Power Requirements |
110V/10A 220V-240V/5A |
Exhaust Requirements |
Two 4 in (102 mm) ports 500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
PLS Series
Free-Standing Platforms
PLS6.150D
Features
Laser Material Processing Area (W x H) | 32 x 18 in (813 x 457 mm) |
Maximum Part Size (W x H x D) | 37 x 23 x 8.5 in (940 x 584 x 216 mm) |
Overall Dimension (W x H x D) | 44 x 39 x 36 in (1118 x 991 x 914 mm) |
Rotary Capacity | Max Diameter 8 in (203 mm) |
Motorized Z Axis Lifting Capacity | 40 lbs (18 kg) |
Available Focus Lenses |
2.0 in (51 mm) HPDFO™ (High Power Density Focusing Optics) |
Laser Platform Interface Panel | Keypad and LCD display show current file name, laser power, engraving speed, PPI and run time. |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included Gas Assist |
Cabinet Style | Free-Standing |
Laser Options |
10, 30, 40, 50, 60 and 75 watts Equipped for two lasers – must be of equal power |
Weight | 345 lbs (156 kg) |
Power Requirements | 220V-240V/15A |
Exhaust Requirements |
Two 4 in (102 mm) ports 500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
PLS6MW
Features
Work Area | 32 x 18 in (813 x 457 mm) |
Maximum Part Size (W x H x D) | 37 x 23 x 8.5 in (940 x 584 x 216 mm) |
Overall Dimension (W x H x D) | 44 x 39 x 36 in (1118 x 991 x 914 mm) |
Rotary Capacity | Max Diameter: 8 in (203 mm) |
Motorized Z Axis Lifting Capacity | 40 lbs (18 kg) |
Available Focus Lenses |
2.0 in (50 mm) MW recommended for most 10.6 and 9.3 micron applications 4.0 in (100 mm) MW recommended for most 1.06 micron applications HPDFO™ (High Power Density Focusing Optics) MW |
Laser Platform Interface Panel | Keypad and LCD display show current file name, laser power, engraving speed, PPI and run time. |
Computer Requirements | Requires dedicated PC with Windows® 7/8/10 32/64 bit and one available USB port (2.0 or higher) |
Optics Protection | Integrated with included Gas Assist |
Cabinet Style | Free-Standing |
1.06 µm (Fiber) | 40 and 50 Watts |
10.6 µm (CO2) | 10, 30, 40, 50, 60 and 75 Watts |
9.3 µm (CO2) | 30, 50, and 75 Watts |
Weight | 345 lbs (156 kg) |
Power Requirements |
110V/10A 220V-240V/5A |
Exhaust Requirements |
Two 4 in (102 mm) ports 500 CFM @ 6 in static pressure (850 m3/hr at 1.5 kPa) |
Click here for a printable PDF overview sheet.
Ultra Series
Laser Processing for a Wide Range of Materials
ULTRA R5000
The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
ULTRA X6000
The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser. When the platform is configured with three lasers, users can take full advantage of MultiWave Hybrid™ technology enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision material-independent autofocus, controllable laser power density, an automation interface, camera registration, an integrated touch screen control panel, over temperature detection, and support for fire suppression.
ULTRA R9000
The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA R9000 platform has a materials processing envelope of 48 x 24 in (1219 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA R9000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
Click here for a printable PDF overview sheet.
Get In Touch
Please call, e-mail, or complete the form and tell us your needs, or simply for a comparison to your existing processes.
Phone
Hours
Monday - Friday
9:00 AM - 5:00 PM
Corporate Location
1101 Church Road
Malvern PA 19355